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authorPunit Agrawal <punit.agrawal@arm.com>2014-06-03 10:59:58 +0100
committerZhang Rui <rui.zhang@intel.com>2014-06-30 10:20:27 +0800
commitdd354b84d47ec8ca53686bdb3cc1aecdeb75bef5 (patch)
treefab1eb7735d8d3c24639f0d32204e032742f8c30 /drivers/thermal/imx_thermal.c
parentca9521b770c988bb6bb8eea1241f7a487dab6ff1 (diff)
thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Diffstat (limited to 'drivers/thermal/imx_thermal.c')
0 files changed, 0 insertions, 0 deletions