From aa1acb0451bb27add173d9641d0b74c58889e693 Mon Sep 17 00:00:00 2001 From: "hongbo.zhang" Date: Thu, 15 Nov 2012 18:56:42 +0800 Subject: Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang Reviewed-by: Viresh Kumar Reviewed-by: Francesco Lavra Signed-off-by: Zhang Rui --- drivers/thermal/Kconfig | 20 ++++++++++++++++++++ 1 file changed, 20 insertions(+) (limited to 'drivers/thermal/Kconfig') diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index 99b6587ab8b..d96da075c9f 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -101,5 +101,25 @@ config EXYNOS_THERMAL If you say yes here you get support for TMU (Thermal Managment Unit) on SAMSUNG EXYNOS series of SoC. +config DB8500_THERMAL + bool "DB8500 thermal management" + depends on ARCH_U8500 + default y + help + Adds DB8500 thermal management implementation according to the thermal + management framework. A thermal zone with several trip points will be + created. Cooling devices can be bound to the trip points to cool this + thermal zone if trip points reached. + +config DB8500_CPUFREQ_COOLING + tristate "DB8500 cpufreq cooling" + depends on ARCH_U8500 + depends on CPU_THERMAL + default y + help + Adds DB8500 cpufreq cooling devices, and these cooling devices can be + bound to thermal zone trip points. When a trip point reached, the + bound cpufreq cooling device turns active to set CPU frequency low to + cool down the CPU. endif -- cgit v1.2.3